OS2-3

[OS2-3-03] Unveiling the relationship between thermal conductivity and the structure of crosslinked epoxy resin

*Yinbo Zhao¹, Gota Kikugawa², Yoshiaki Kawagoe³, Keiichi Shirasu⁴, Tomonaga Okabe⁵ (1. Tohoku University, 2. Tohoku University, 3. Tohoku University, 4. Tohoku University, 5. Tohoku University)

キーワード：Epoxy resin, Thermal Conductivity, Molecular dynamics simualtions, Crosslinking