10:50 〜 11:10
[OS9-2-01] Thermal Boundary Resistance of Ruthenium Interconnects in Next Generation VLSI
キーワード:Thermal Boundary Resistance, Ruthenium Interconnects, Thermal Management, Interfacial Bonding
Oral Presentation
OS9
2022年9月30日(金) 10:50 〜 11:50 Room 4 (Zoom room 4)
Chair:Satoru Momoki(Nagasaki University, Japan),
Tomoyuki Hatakeyama(Toyama Prefectural University, Japan)
10:50 〜 11:10
キーワード:Thermal Boundary Resistance, Ruthenium Interconnects, Thermal Management, Interfacial Bonding