B-5 Non-traditional machinings and additive manufacturings

[B-5-9] Development of a dicing process for 4H-SiC wafers by Plasma Chemical Vaporization Machining (PCVM) using a metal slit mask

〇Yuma Nakanishi¹、Risa Mukai¹、Satoshi Matsuyama¹、Kazuto Yamauchi¹、Yasuhisa Sano¹ (1.Osaka University)

キーワード：Processing、dicing、plasma etching