10:40 AM - 11:00 AM
*Haruki Nakamura1, Seiji Wakabayashi1, Satoko Honda1, Takayuki Arie1, Seiji Akita1, Kuniharu Takei1 (1. Osaka Prefecture University)
Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices
Thu. Jun 30, 2022 10:40 AM - 12:00 PM Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices (A10)
Chairman:Sanjay Malik(FUJIFILM ELECTRONIC MATERIALS U.S.A.), Akira Watanabe(Tohoku University)
10:40 AM - 11:00 AM
*Haruki Nakamura1, Seiji Wakabayashi1, Satoko Honda1, Takayuki Arie1, Seiji Akita1, Kuniharu Takei1 (1. Osaka Prefecture University)
11:00 AM - 11:20 AM
*Nyamjargal Ochirkhuyag1, Satoru Mizuguchi1, Yuuki Nishitai1, Kazuhide Ueno1, Hiroki Ota1 (1. Yokohama National University )
11:20 AM - 11:40 AM
*YAN XUAN1, Hyuga Hara1, Satoko Honda1, Yanpeng Li1, Yusuke Fujita1, Takayuki Arie1, Seiji Akita1, Kuniharu Takei1 (1. Department of Physics and Electronics, Osaka Prefecture University)
11:40 AM - 12:00 PM
*Yuji Isano1, Hajime Fujita2, Koki Murakami1, Sijie Ni1, Yuta Kurotaki1, Tamami Takano1, Yutaka Isoda1, Ryosuke Matsuda1, Fumika Nakamura1, Yuuki Nishitai1, Nyamjargal Ochirkhuyag1, Kota Inoue1, Hiroki Kawakami1, Yusuke Okubo3, Kazuhide Ueno1, Toshinori Fujie2, Hiroki Ota1 (1. Yokohama National University, 2. Tokyo Institute of Technology, 3. National Institute of Health Science)