The 39th International Conference of Photopolymer Science and Technology

講演情報

印刷

Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices

[Packaging I] Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices

2022年6月30日(木) 09:00 〜 10:40 Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices (A10)

Chairman:Takumi Ueno(Shinshu University), Masao Tomikawa(Toray)

09:30 〜 09:50

[3A1002] Patterning Strategies for High Density Packages for Diverse Applications [Invited]

*Sanjay Malik1 (1. FUJIFILM ELECTRONIC MATERIALS U.S.A., Inc.)