10:40 〜 11:00
講演情報
Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices
[Packaging II] Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices
2022年6月30日(木) 10:40 〜 12:00 Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices (A10)
Chairman:Sanjay Malik(FUJIFILM ELECTRONIC MATERIALS U.S.A.), Akira Watanabe(Tohoku University)