10:40 AM - 11:00 AM
Presentation information
Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices
[Packaging II] Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices
Thu. Jun 30, 2022 10:40 AM - 12:00 PM Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices (A10)
Chairman:Sanjay Malik(FUJIFILM ELECTRONIC MATERIALS U.S.A.), Akira Watanabe(Tohoku University)