The 26th International Display Workshops (IDW '19)

講演情報

Oral Presentation

[FLX6] Advanced Process and Evaluation for Flexible Electronics

2019年11月29日(金) 15:00 〜 16:00 Room 204 (2F)

Chair: Tadahiro Furukawa (Yamagata University)
Co-Chair: Akira Nakazawa (AGC Inc.)

15:25 〜 15:45

[FLX6-2] Analysis and Design of Mechanical Stresses on Foldable Devices

*Nao Ando1, Kei Hyodo1, Hisao Sasaki1, Yoshihito Ota1, Tomoki Sasayama2, Yoshihiko Iwao2, Tomoya Tsuda2, Nao Terasaki3 (1. YUASA SYSTEM (Japan), 2. Shimadzu Co. (Japan), 3. AIST (Japan))

キーワード:Mechanical stresses, Foldable devices, Endurance test, Mechanoluminescent material

Knowledge of mechanical stresses on foldable devices is important to develop them. When you study stresses, you should control motion profile then study dynamic strain energy. In our study, we slightly adjusted each testing conditions to figure out effect from these difference and sensitivity of the analyzing method.