[FMC2] Metrology and Manufacturing

[FMC2-1(Invited)] Surface Strain Analysis of Bending Substrates for Design of Flexible Devices

*Atsushi Shishido¹ (1. Tokyo Institute of Technology (Japan))

キーワード：Flexible, Foldable, Wearable, Strain, Bending

Fracture and fatigue of bending flexible materials and devices prevent their commercialization. The problem is that quantitative understanding has not been explored on bending behavior. Here we report quantitative analysis of surface strain of bending substrates by a surface labeled grating method.