The 26th International Display Workshops (IDW '19)

講演情報

Poster Presentation

[FMCp3] Metrology & Manufacturing

2019年11月28日(木) 10:40 〜 13:10 Main Hall (1F)

10:40 〜 13:10

[FMCp3-5] Post-oven Induced Surface Hydrophobicity Degradation of CF4 Plasma Treated Polyimide Photo Resistance

*Letao Zhang1,2, Xiaoliang Zhou2, Peng Zhang1, Yingchun Fan1, Qiankun Xu1, Liangfen Zhang1, Xiaoxing Zhang1, Yuan Jun Hsu1, Shengdong Zhang2 (1. Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. (China), 2. Peking University (China))

キーワード:polyimide film, hydrophobicity, plasma treatment, bank, post-oven

Polyimide films were treated by CF4 plasma to serve as bank material for inkjet printing OLED. Excellent hydrophobicity was thus obtained due to the F implantation. However, degradation of hydrophobicity was observed by post-oven, an inevitable process for inkjet printing. This degradation is probably caused by the H2O/O2 chemical adsorption.