セッション情報

Oral Presentation

[6] Session #6
3D NAND

2019年5月15日(水) 08:30 〜 11:10 IMW2019

Session Chairs: Antonio Arreghini, IMEC, Tomoya Sanuki, Toshiba Memory

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08:30 〜 08:55

[6-1(Invited)] Reliability challenges in 3D NAND Flash memories

Cristian Zambelli (University of Ferrara)

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08:55 〜 09:20

[6-2] Improvement of conduction in 3-D NAND memory devices by channel and junction optimization

Antonio Arreghini (IMEC)

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09:20 〜 09:45

[6-3] Data Pattern & Memory Variation Aware Fine-Grained ECC Optimized by Neural Network for 3D-TLC NAND Flash Memories with 2.0x Data-retention Time Extension and 30% Parity Overhead Reduction

Toshiki Nakamura (Chuo University)

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10:15 〜 10:40

[6-4] Study of Self-Healing 3D NAND Flash with Micro Heater to Improve the Performances and Lifetime for Fast NAND in NVDIMM Applications

Tzu-Hsuan Hsu (Macronix)

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10:40 〜 11:10

[6-5] Impact of SiON tunnel layer composition on 3D NAND cell performance

Laurent Breuil (IMEC)

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