IMW2019

講演情報

Oral Presentation

[1] Session #1
Invited keynotes

2019年5月13日(月) 08:50 〜 11:20 IMW2019

Session Chairs:Akira Goda, Micron, Zhiqiang Wei, Rambus

10:20 〜 10:50

[1-3] High Speed, Low Power, and Ultra-small Operating Platform by Three-dimensional Integration (3DI) by Bumpless Interconnects

Koji Sakui (Honda Research Institute Japan)

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