Growth behavior of compounds due to reactive diffusion between solid Co and liquid Sn-Cu alloys

10:25 〜 10:40

[336] Growth behavior of compounds due to reactive diffusion between solid Co and liquid Sn-Cu alloys

*オミンホ¹、梶原正憲¹ (1. Tokyo Institute of Technology, Dept. Mater. Sci. Eng.)

キーワード：reactive diffusion、intermetallic compound、Co-Sn system

Kinetics of the reactive diffusion between solid Co and liquid Sn-Cu was experimentally observed using isothermal bonding technique.

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