[G] Packaging

[260] Evaluation of Fatigue Crack Propagation Characteristics at the Interface between Si Die and Underfill in Real Semiconductor Package Structure

*Hidetoshi HARA¹, Yoshiaharu KARIYA², Takayuki FUJITA³, Toshiaki ENOMOTO³, Hiroshi YAMAGUCHI³, Takuya YOSHIDA³ (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology, 3. NAMICS Corporation)

Keywords:Fatigue crack propagation、Interface crack、Underfill material、Finite element method、Semiconductor Package

4点曲げ疲労試験により半導体/封止樹脂界面の疲労き裂進展特性を評価する手法の開発を試みた．その結果，FEM解析とき裂進展計測結果を組み合わせることで，界面の疲労き裂進展則が得られるという指針を得た．