^〇(P)Papichaya Chaisakul^1,2, Vladyslav Vakarin², Delphine Marris-Morini², Jacopo Frigerio³, Giovanni Isella³, Kazumi Wada¹, Laurent Vivien² (The University of Tokyo¹, University of Paris-Sud², Politecnico di Milano³)

^〇(M1C)Deng Yugao, Wada Kazumi (Department of Material Engineering, University of Tokyo)

^○Junichi Suzuki¹, Yusuke Hayashi¹, Yuki Kuno¹, JoonHyun Kang¹, Tomohiro Amemiya², Nobuhiko Nishiyama¹, Shigehisa Arai^1,2 (Tokyo Inst. Tech., Dept. Electrical and Electronic Engineering¹, QNERC²)

^○Kota Okazaki^1,2, Hidetaka Nishi^1,2, Tai Tsuchizawa^1,2, Tsuyoshi Yamamoto², Koji Yamada^1,2 (NTT NPC¹, NTT MI Labs.²)

^○Ziyi Zhang¹, Motoki Yako¹, Kan Ju¹, Naoyuki Kawai¹, Tai Tsuchizawa², Koji Yamada², Hiroshi Fukuda², Kazumi Wada¹ (The University of Tokyo¹, NTT Microsystem Integration Laboratoies²)

^○(M1)Akihiro Kitao¹, Kenji Imakita¹, Ibuki Kawamura¹, Minoru Fujii¹ (Kobe. Univ¹)

^○Kengo Miura¹, Takayoshi Hirasawa¹, JoonHuyn Kang¹, Yuya Shoji¹, Yukihiro Okada², Hideki Yokoi², Nobuhiko Nishiyama¹, Shigehisa Arai¹ (Tokyo Tech.¹, Shibaura Inst. Tech.²)

^○Eiichi Ishida¹, Yuya Shoji¹, Kengo Miura¹, Hideki Yokoi², Tetsuya Mizumoto¹ (Tokyo Tech.¹, Shibaura Inst. Tech.²)

^○Tomohiro Kita¹, Rui Tang¹, Hirohito Yamada¹ (Tohoku Univ.¹)