[14p-1A-1~6] International Symposium on Thin Film Technologies for Flexible Devices

▲ [14p-1A-4] Microelectronic Ceramic Integration Technology at Low Temperature

〇Yoshihiko Imanaka¹ (1.Fujitsu Lab.)

Keywords:dielectrics,electroceramics

Currently, thin electrical element modules are needed to achieve the miniaturization and multifunction capabilities of mobile terminals. Accordingly, passive integration of flexible electronics is demanded. In this study, dense, thick, and organic binder- free ceramic green-state film made of nanoparticles is presented as a promising candidate for the passive elements of flexible electronics.