[16a-2K-1~12] 1.3 Novel technologies and interdisciplinary engineering

[16a-2K-3] Fabrication of Porous Electrode Wiring and Plating for Lowering the Resistance

〇HIDEO TOKUHISA¹, SHIHO TSUKAMOTO¹, NAOKI SHIRAKAWA¹ (1.AIST FLEC)

Keywords:copper,electrode wiring,low resistance

In this study, in order to fabricate a low resistant electrode wiring with almost the same size as the printed pattern, we attempted to form a porous electrode wiring so that a plating solution can penetrate into the inside of the printed wiring and lower the resistance by filling the voids.