[20a-234B-1~10] 22.1 合同セッションM 「フォノンエンジニアリング」

▲ [20a-234B-9] Low Thermal Conductivity of Colloidal Quantum Dot Assemblies for Thermoelectric

〇Satria Zulkarnaen Bisri¹、Maria Ibanez²、Ricky Dwi Septianto^1,3、Maksym Kovalenko²、Yoshihiro Iwasa^1,4 (1.RIKEN-CEMS、2.ETH Zurich、3.Inst. Tech. Bandung、4.Univ. Tokyo)

キーワード：colloidal quantum dots, thermoelectric, thermal conductivity

Here we report the low value of thermal conductivity measured in assemblies of lead chalcogenide colloidal quantum dots that are interconnected by crosslinking ligands. The observation of low thermal conductivity values in this kind of quantum dot assemblies might enable us to develop thermoelectric devices with an unprecedented value of ZT, considering the potential to obtain high Seebeck coefficient from the 0-dimensional system.