[17p-P8-1~24] 13.5 Semiconductor devices and related technologies

[17p-P8-19] Evaluation of SCM Specifications
in SCM/NAND Flash Hybrid SSD with Through-Silicon Via

〇Atsuya Suzuki¹, Yusuke Sugiyama¹, Chihiro Matsui¹, Ken Takeuchi¹ (1.Chuo Univ.)

Keywords:Through Silicon Via