2019年第80回応用物理学会秋季学術講演会

講演情報

一般セッション(口頭講演)

9 応用物性 » 9.4 熱電変換

[19p-E307-1~15] 9.4 熱電変換

2019年9月19日(木) 13:15 〜 17:30 E307 (E307)

林 慶(東北大)、小菅 厚子(阪府大)、小峰 啓史(茨城大)

17:15 〜 17:30

[19p-E307-15] Interface engineering to enhance the thermoelectric properties of solution-processed thin film

Ajay Kumar Baranwal1、Shrikant Saini2、Daisuke Hirotani3、Tomohide Yabuki2、Satoshi Iikubo3、Koji Miyazaki2、Shuzi Hayase1 (1.Univ. Electro-Commu、2.Kyushu Inst. Tech.、3.Kyu. Inst. Tech.)

キーワード:Ultra low thermal conductivity, CsSnI3 Perovskite, Thermoelectric devices

Solution-processed materials have significant relevance for thermoelectric applications owing to easy and low-cost processing. However, the trade-off among thermoelectric parameters hinders their prospect for efficient thermoelectric applications. Perovskite-based multi-atomic crystals are in limelight because of ultra-low thermal conductivity. Among them, CsSnI3 are inorganic perovskite crystal to be explored for thermoelectric applications. The CsSnI3 crystal assists the existence of Sn2+ to hold the SnI6 octahedra. However, the instability of Sn2+ into Sn4+ leads to generate more conducting behavior and intrinsic defects. We utilize this novel unusual behavior of CsSnI3 crystal by employing an inorganic scaffold which supports the CsSnI3 crystal growth by providing improved surface area. Due to the differed resulting crystal growth, the electrical conductivity and phonon scattering resistance were increased.
The details of fabrication and figure of merit enhancement in composite film shall be discussed in detail in the conference.