The 81st JSAP Autumn Meeting, 2020

Presentation information

Print

Oral presentation

12 Organic Molecules and Bioelectronics » 12.7 Biomedical Engineering and Biochips

[9a-Z12-1~11] 12.7 Biomedical Engineering and Biochips

Wed. Sep 9, 2020 9:00 AM - 12:00 PM Z12

Toshihiko Noda(Toyohashi Univ. of Tech.), Tetsu Tanaka(Tohoku Univ.)

10:00 AM - 10:15 AM

[9a-Z12-5] PPG Sensor Integration Using Fan-Out Wafer-Level Packaging for Trans-Nail Pulse-Wave Monitoring

〇Tomo Odashima1, Susumago yuki1, Zhengyang Qian1, Noriyuki Takahashi2, Shuta Nagata1, Hisashi Kino3, Tetsu Tanaka1,2, Takafumi Fukushima1,2 (1.Graduate School of Engineering, Tohoku Univ., 2.Graduate School of Biomedical Engineering, Tohoku Univ., 3.FRIS, Tohoku Univ.)

Keywords:flexible hybrid electronics