The 70th JSAP Spring Meeting 2023

Session information

Oral presentation

12 Organic Molecules and Bioelectronics » 12.7 Biomedical Engineering and Biochips

[18p-E102-1~13] 12.7 Biomedical Engineering and Biochips

Sat. Mar 18, 2023 1:30 PM - 5:00 PM E102 (Building No. 12)

Yasufumi Yokoshiki(Tokyo Institute of Technology), Hisashi Kino(Tohoku Univ)

△:Presentation by Applicant for JSAP Young Scientists Presentation Award
▲:English Presentation
▼:Both of Above
No Mark:None of Above

×

Authenticate

×

Only registered participants can view the abstract PDF.
◆Early bird registrant
Participant ID and password has been sent to your registered email address on February 27.
◆Late registrants
Participant ID and password will be included in a payment confirmation email.
» Participant Log In