09:15 〜 09:30
▼ [16a-B409-2] Integration Technology for Smart Skin Display II: Bendability Enhancement of Multi-level Metallization on a PDMS Elastomer
キーワード：Flexible Hybrid Electronics, Bendable wire, Multi-level metallization
This study is motivated by the stress control of top wires for Smart Skin Display. Regarding double layer wiring, the stress applied to bottom wires of Smart Skin Display when bending can be decreased by positioning its stress neutral axis, but the bending stress of the top wires cannot be lowered. A structurally new wiring design is proposed to enhance the bendability of Smart Skin Display as an FHE device based on fan-out wafer-level packaging (FOWLP).
In this work, first, the magnitude of the stress applied to the FOWLP-based FHE is simulated using a finite element method (FEM) to know the optimized wire structure for the subsequent experimental work. Second, this study proposes non-prestrain 3D wavy wires interconnecting the embedded components used in Smart Skin Display. The fan-out wires are fabricated on a corrugated layer photolithographically formed with a photosensitive dielectric. With the simulation verifying the feasibility of corrugation designs, we fabricate 3D corrugated interconnections, characterize the bendable properties, and compare them to 2D planar wires.
In this work, first, the magnitude of the stress applied to the FOWLP-based FHE is simulated using a finite element method (FEM) to know the optimized wire structure for the subsequent experimental work. Second, this study proposes non-prestrain 3D wavy wires interconnecting the embedded components used in Smart Skin Display. The fan-out wires are fabricated on a corrugated layer photolithographically formed with a photosensitive dielectric. With the simulation verifying the feasibility of corrugation designs, we fabricate 3D corrugated interconnections, characterize the bendable properties, and compare them to 2D planar wires.