The 70th JSAP Spring Meeting 2023

Presentation information

Oral presentation

22 Joint Session M » 22.1 Joint Session M "Phonon Engineering"

[18a-D511-1~10] 22.1 Joint Session M "Phonon Engineering"

Sat. Mar 18, 2023 9:00 AM - 11:45 AM D511 (Building No. 11)

Tsunehiro Takeuchi(Toyota Technol. Inst.), Takanobu Watanabe(Waseda Univ.)

10:00 AM - 10:15 AM

[18a-D511-5] Large-scale Integration of Cavity-free Micro Thermoelectric Device (4) Sensitivity for Heat Flux

〇(DC)Md MehdeeHasan Mahfuz1, Motohiro Tomita2, Takeo Matsuki3, Takanobu Watanabe1 (1.Waseda Univ., 2.Seikei Univ., 3.AIST)

Keywords:Thermoelectric generator, GeSn device, Seebeck effect

This work demonstrates a large-scale integrated thermoelectric (TE) device with a cavity-free architecture that can serve as a suitable heat flux sensor. Conventional heat flux sensors have difficulty to achieve both detection sensitivity and minimal impact on the measurement target. -free TE device could solve these problems, because its thermal resistance can be kept small and the sensitivity for the heat flux can be improved by miniaturization and large-scale integration. In this work, we investigated the heat flux sensitivity of our proposed device by Fabricating a large-scale integrated TE module.