Session 15: Micro-welding

[R3-S15-2] Direct bonding of semiconductors by through-transmission laser welding

*Pol Sopeña¹, Andong Wang², Alexandros Mouskeftaras¹, David Grojo¹ (1. Aix-Marseille Université, CNRS, LP3 (France), 2. University of Oxford, Department of Engineering Science (UK))

キーワード：laser welding, laser processing, wafer bonding, semiconductors, silicon

C000030