The 9th International Conference on Multiscale Materials Modeling

講演情報

Poster Session

O. Tribology and Interface: Multi-Scale, Multi-Physics, and Multi-Chemistry Phenomena in Friction, Lubrication, Wear, and Adhesion

[PO-O1] Poster Session 1

Symposium O

2018年10月29日(月) 17:45 〜 20:00 Poster Hall

[P1-82] Mechanochemistry induced atomic wear in chemical mechanical polishing processes

Jialin Wen, Tianbao Ma, Xinchun Lu (Dept. of Mechanical Engineering, Tsinghua Univ., China)

Chemical mechanical polishing (CMP) is widely applied in the semiconductor industry to achieve ultra-high precision manufacturing of surfaces (such as Si and Cu), however, its mechanisms remain elusive because of interaction between chemical effects (such as the chemical reactions with the existence of H2O2 and glycine) and mechanical effects (such as the tribology process). By using molecular dynamics simulations based on the ReaxFF reactive force field, we have explored the CMP mechanisms at the atomic level and have revealed the importance of mechanochemistry induced atomic wear during the CMP processes.