[P2-72] Disconnection interaction in Cu grain boundaries
Recent molecular dynamics (MD) simulations and transmission electron microscopy indicate that the grain boundary (GB) migration in asymmetric GB plane orientation is mediated by the nucleation and migration of disconnections in the GB plane. The collective motion and reaction of disconnections also initiates the formation of facets as the agglomeration of disconnections into a disconnection arrays.
In MD simulations we address the interaction of disconnection and disconnection dipoles at zero stress in S3 and S7 GBs. The diffusive rearrangement at finite temperate is analyzed in terms of one-dimensional random walks and the drift signatures are used to deduce the interaction strength and the disconnection core interaction. The implications of the disconnection-interaction on the collective migration of asymmetrical GBs is discussed in context of grain coarsening in fcc metals at elevated temperatures and the transition to stress-driven grain coarsening in nanocrystalline metals.
In MD simulations we address the interaction of disconnection and disconnection dipoles at zero stress in S3 and S7 GBs. The diffusive rearrangement at finite temperate is analyzed in terms of one-dimensional random walks and the drift signatures are used to deduce the interaction strength and the disconnection core interaction. The implications of the disconnection-interaction on the collective migration of asymmetrical GBs is discussed in context of grain coarsening in fcc metals at elevated temperatures and the transition to stress-driven grain coarsening in nanocrystalline metals.