*Chizuru Sawabe1, Shohei Kumagai1, Chikahiko Mitsui1, Masakazu Yamagishi2, Masayuki Sasaki1, Tatsuyuki Makita1, Naotaka Kasuya1, Hiroyasu Sato3, Shun Watanabe1,4, Jun Takeya1,4,5, Toshihiro Okamoto1,6,7
(1. Material Innovation Research Center (MIRC) and Department of Advanced Materials Science, Graduate School of Frontier Sciences, The Univ. of Tokyo (Japan), 2. National Institute of Technology, Toyama College (Japan), 3. Rigaku Corporation (Japan), 4. National Institute of Advanced Industrial Science and Technology (AIST)-University of Tokyo Advanced Operando-Measurement Technology Open Innovation Laboratory (OPERANDO-OIL), AIST (Japan), 5. International Center for Materials Nanoarchitectonics (MANA), National Institute for Materials Science (NIMS) (Japan), 6. PRESTO, JST (Japan), 7. CREST, JST (Japan))
Keywords:organic semiconductor, OFET, thermal durability, ultrathin single-crystalline film