OECC/PSC 2019

講演情報

Oral Sessions

O4. Optical Active Devices and Modules

[WD2] III-V and Hybrid Active Devices

2019年7月10日(水) 11:00 〜 12:15 Room D (414, 4F, Fukuoka International Congress Center)

Presider: Naokatsu Yamamoto (NICT, Japan)

11:45 〜 12:00

[WD2-3] Compact InP MZM Optical Sub-Assembly with Built-in Electrical Filters by Three-Dimensional Packaging Technique

〇Fukiko Hirose, Keita Mochizuki, Junichi Suzuki, Shusaku Hayashi, Yosuke Suzuki, Kiyotomo Hasegawa (Mitsubishi Electric Corporation, Japan)

キーワード:Packaging technology of photonic devices and circuits, Optical modulators

We developed compact InP-based MZM sub-assemblies with built-in electrical filters by using flip-chip bonding technique. We realized the E/O response at -3 dB of 41 GHz and EVM of 14.9% for 50 Gbaud QPSK modulation.

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