Session 3

[ICNN4-02(Invited)] Integration of heterogeneous photonic chiplets by µ-transfer printing

*Rai Kou¹, Koji Yamada¹ (1. National Institute of Advanced Industrial Science and Technology)

Recent progress and future prospects for miniaturized heterogeneous integration using µ-transfer printing method will be presented. Current silicon photonic devices with this approach can realize compact laser sources, isolators, modulators, frequency comb sources and 3D-stacked photonic devices.