Bonding Technology & ATLA Project - 3

[TILA-LIC8-05] Temperature distribution simulations in Cr:LiSAF DFC chip for high power broadband tiny integrated laser in 800-950 nm range

*Florent Cassouret¹, Takunori Taira^1,2 (1. Institute for Molecular Science, 2. RIKEN SPring-8 center)

Thermal distribution calculation on new designed Cr:LiSAF DFC chip shows 4 times lower temperature compared to bulk crystal under 100W-diode pumping which could lead to over 40W output power.