[Session 5] Interface and Reliability/Variability

[Session_5-05] Effect of Metal Coupling on Schottky Barrier Height Extraction

Sheng-Kai Su¹, Edward Chen¹, Alfonso Sanchez-Soares², Thomas Kelly², Giorgos Fagas^2,4, *James C. Greer^2,5, Gregory Pitner ³, H.-S. Philip Wong^1,6, Iuliana P. Radu¹ (1. TSMC, Hsinchu, Taiwan, 2. EOLAS Designs Ltd, 3. TSMC, San Jose, USA, 4. Tyndall Nat'l Inst., Univ. College Cork, 5. Electrical and Electronic Engineering Department, Univ. of Nottingham Ningbo China, 6. Department of Electrical Engineering, Stanford Univ.)