High-Bendable 3D Corrugated Interconnections for Chiplet-Embedded Flexible Hybrid Electronics Using Wafer-Level Packaging

Chang Liu

doi:https://doi.org/10.7567/SSDM.2023.G-5-02

講演情報

Focus Session

Focus Session (Area 1&3)

[G-5] Heterogenous Integration for High Performance Computing; System, Material, Process and Chiplet I

2023年9月8日(金) 09:00 〜 10:15 Room G (231, Bldg. 2)

Session Chairs: Takeyasu Saito (Osaka Metropolitan Univ.), François Andrieu (CEA-Leti)

09:30 〜 09:45

[G-5-02] High-Bendable 3D Corrugated Interconnections for Chiplet-Embedded Flexible Hybrid Electronics Using Wafer-Level Packaging

^○Chang Liu¹, Tadaaki Hoshi¹, Jiayi Shen¹, Atsushi Shinoda¹, Zehua Du¹, Hisashi Kino^1,2, Tetsu Tanaka^1,2, Takafumi Fukushima^1,2 (1. Graduate School of Eng., Tohoku Univ. (Japan), 2. Graduate School of Biomedical Eng., Tohoku Univ. (Japan))

https://doi.org/10.7567/SSDM.2023.G-5-02

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講演情報

[G-5] Heterogenous Integration for High Performance Computing; System, Material, Process and Chiplet I

[G-5-02] High-Bendable 3D Corrugated Interconnections for Chiplet-Embedded Flexible Hybrid Electronics Using Wafer-Level Packaging

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