High-Speed Operation at 25ns Enabled by Angstrom Layer HZO Technology in MFS IGZO Device with Ultra-Wide Memory Window and Low Thermal Budget

CHENG- RUI LIU

講演情報

Short Oral Presentation

02: Advanced and Emerging Memories / New Applications

[SO-PS-02] 02: Advanced and Emerging Memories / New Applications

2023年9月7日(木) 13:30 〜 14:18 Room K (234, Bldg. 2)

Session Chairs: Atsushi Himeno (Panasonic Holdings Corporation), Ming-Hsiu Lee (Macronix International Co., Ltd)

14:10 〜 14:12

[SO-PS-02-21] High-Speed Operation at 25ns Enabled by Angstrom Layer HZO Technology in MFS IGZO Device with Ultra-Wide Memory Window and Low Thermal Budget

^○CHENG- RUI LIU¹, SHENG-MIN WANG¹, YU-TING CHEN¹, SHAO-CHEN LEE¹, YING-TSAN TANG¹ (1. National Central Univ. (Taiwan))

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講演情報

[SO-PS-02] 02: Advanced and Emerging Memories / New Applications

[SO-PS-02-21] High-Speed Operation at 25ns Enabled by Angstrom Layer HZO Technology in MFS IGZO Device with Ultra-Wide Memory Window and Low Thermal Budget

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