2024年粉末冶金国際会議

講演情報

General Sessions (Oral) » T8 MIM - New Processing Routes

[T8] MIM - New Processing Routes

Oral

2024年10月15日(火) 14:00 〜 15:40 Room D (3F 304, Conference Center)

Chairpersons: Hidefumi Nakamura (EPSON ATMIX Corporation, Japan), Abu Bakar Sulong (Universiti Kebangsaan Malaysia, Malaysia)

14:00 〜 14:20

[15D-T8-01] High Flow MIM Binders Suitable for High Precision Parts with Reduced Voids.

*M. Fukai1, Y. Shirai1 (1.Asahi Kasei corp, Japan)

キーワード:MIM, POM, Thermal debinding, Binder

Binders for metal injection molding (MIM) are generally composed of various chemical materials. Mixing multiple materials in production of binders are required to control binder volatilization temperature, especially for thermal binders. Polyoxymethylene (POM) is a promising ingredient of binder that is used for catalytic debinding system due to the low residue formation. Furthermore, since the volatilization temperature of POM is lower than that of polyolefin resins, POM is also suitable for thermal debinding system. However, it is difficult to use POM as a component of thermal binders because of its poor miscibility of other materials and high reactivity with inorganic powders, respectively. In this work, we have developed a new binder, which includes high flow POM and can be used for thermal debinding system. We would like to discuss some of characteristics such as reduced odor in kneading process, fluidity of feedstock, and reduced voids in sintered body.