Wrap-Around Electrode Fabrication via Laser Ablation

Ya-Huei Chang

doi:https://doi.org/10.36463/idw.2023.0426

[FMCp2-3] Wrap-Around Electrode Fabrication via Laser Ablation

*Ya-Huei Chang¹, Jie-Chi Chen², Dih-Yang Kuo¹, Kuan-Ting Kuo¹, Rajesh Vaddi¹, Sean M Garner¹ (1. Corning Incorporated (United States of America), 2. Industrial Technology Research Institute (Taiwan))

microLED, wrap-around electrodes, seamless tiling

https://doi.org/10.36463/idw.2023.0426

Wrap around electrodes with 50 um linewidth and 150 um spacing have been demonstrated on an as cut glass edge profile of Corning Lotus NXT glass with a thin film transistor array via a laser ablation approach. WAEs exhibit intact integrity of circuits, conformal deposition, and good adhesion.

Proceedings of the International Display Workshops Volume 30 (IDW '23)

[FMCp2-3] Wrap-Around Electrode Fabrication via Laser Ablation