Studies of Corrosive Outgasses from Via Holes Using Thermal Desorption Spectroscopy

S. Tokitoh; H. Uchida; Y. Okuno; K. Fushimi; G. Liu; Y. Sakaya; N. Hirashita

doi:https://doi.org/10.7567/SSDM.1994.C-10-3

[C-10-3] Studies of Corrosive Outgasses from Via Holes Using Thermal Desorption Spectroscopy

S. Tokitoh, H. Uchida, H. Uchida, Y. Okuno, K. Fushimi, G. Liu, Y. Sakaya, N. Hirashita (1.VLSI Research and Development Center, Process Technology Center OKI Electric Industry Co., Ltd.)

https://doi.org/10.7567/SSDM.1994.C-10-3

1994 International Conference on Solid State Devices and Materials

[C-10-3] Studies of Corrosive Outgasses from Via Holes Using Thermal Desorption Spectroscopy