[C-11-2] Ammonium Salt Added Silica Slurry for Chemical Mechanical Polishing (CMP) of Interlayer Dielectric Film

Y. Hayashi、M. Sakurai、T. Nakajima、K. Hayashi、S. Sasaki、S. Chikaki、T. Kunio (1.Microelectronics Research Laboratories, Microcomputer Division, NEC)

https://doi.org/10.7567/SSDM.1994.C-11-2