[A-6-3] Thin and Low-Resistivity Tantalum Nitride Diffusion Barrier and Giant-Grain Copper Interconnects for Advanced ULSI Metallization

Shin-ichi Nakao、Masashi Numata、Tadahiro Ohmi (1.Department of Electronic Engineering, Graduate School of Engineering, Tohoku University、2.New Industry Creation Hatchery Center, Tohoku University)

https://doi.org/10.7567/SSDM.1998.A-6-3