[B-13-1] A Novel and Low Thermal Budget Planarization Scheme for Pre-Metal Dielectric Using Electron-Beam Cured HSQ (Hydrogen Silsesquioxane) in STC (Stacked Capacitor) DRAM

Hae-Jeong Lee、Seong-Ho Kim、Juseon Goo、Byeong Jun Kim、Ho-Kyu Kang、Sang-In Lee、Moon Yong Lee (1.Semiconductor R&D Center, Samsung Electronics Co., LTD.)

https://doi.org/10.7567/SSDM.1999.B-13-1