Evaluation of PECVD a-SiC:H as a Cu Diffusion Barrier Layer of Cu Dual Damascene Process

Soo Gun Lee; Hyeok-Sang Oh; Hong-Jae Shin; Jin-Gi Hong; Hyeon-Deok Lee; Hokyu Kang

doi:https://doi.org/10.7567/SSDM.2000.A-2-6

2000 International Conference on Solid State Devices and Materials

Aug 29, 2000 - Aug 31, 2000
Sendai International Center, Sendai, Japan

[A-2-6] Evaluation of PECVD a-SiC:H as a Cu Diffusion Barrier Layer of Cu Dual Damascene Process

Soo Gun Lee, Hyeok-Sang Oh, Hong-Jae Shin, Jin-Gi Hong, Hyeon-Deok Lee, Hokyu Kang (1.Process Development Team, Semiconductor R&D center, Samsung Electronics)

https://doi.org/10.7567/SSDM.2000.A-2-6

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