[LC-1-1] Au Bump Interconnection with Ultrasonic Flip-chip Bonding in 20μm pitch

Kazumasa Tanida、Mitsuo Umemoto、Ryoichi Kajiwara、Yoshihiro Tomita、Yukiharu Akiyama、Kenji Takahashi (1.Association of Super-Advanced Electronics Technologies (ASET) Electronic System Integration Technology Research Department, Tsukuba Research Center)

https://doi.org/10.7567/SSDM.2002.LC-1-1