[G-7-3] Shear Stress Analyses in Chemical Mechanical Planarization Processing with Cu/porous low-k Structure

Masako Kodera, Yoshihiro Mochizuki, Akira Fukuda, Hirokuni Hiyama, Manabu Tsujimura (1.Process and Manufacturing Engineering Center, Toshiba Semiconductor Company, 2.Ebara Research Corp., 3.Ebara Corp.)

https://doi.org/10.7567/SSDM.2006.G-7-3