[P-5-1] The Formation of Lateral Interconnections Extending over 100-μm-Thick Chips

M. Murugesan¹、J. Bea¹、T. Konno¹、H. Kino¹、Y. Ohara¹、T. Fukushima¹、T. Tanaka¹、M. Koyanagi¹ (1.Tohoku Univ., Japan)

https://doi.org/10.7567/SSDM.2008.P-5-1