[D-8-4] Hard Mask through UV Light-induced Damage to Low-k Film During Plasma Process for Dual Damascene

N. Matsunaga^1,2, H. Okumura¹, B. Jinnai¹, S. Samukawa¹ (1.Tohoku Univ.(Japan), 2.Toshiba Corp.(Japan))

https://doi.org/10.7567/SSDM.2009.D-8-4