[C-8-6L] A Novel Compact-Model of Quasi-Ballistic Nanowire MOSFETs

K. Natori¹ (1.Tokyo Inst. Tech.)

2009 International Conference on Solid State Devices and Materials |PDF ダウンロード

[D-1-1] Through-Si-Via Technology Solutions for 3D System Integration

E. Beyne¹、B. Swinnen¹、J. V. Olmen¹、D. S. Tezcan¹、A. Jourdain¹、P. Limaye¹ (1.IMEC)

2009 International Conference on Solid State Devices and Materials |PDF ダウンロード

[D-1-2] Development of EEB (Electroplated-Evaporation Bumping) Technology for Fine Pitch and Low Resistance Cu/Sn Micro-Bumps

Y. Ohara¹、A. Noriki¹、E. Iwata¹、T. Hiraki¹、K. W. Lee¹、M. Murugesan¹、J. C. Bea¹、T. Fukushima¹、T. Tanaka¹、M. Koyanagi¹ (1.Tohoku Univ.)

2009 International Conference on Solid State Devices and Materials |PDF ダウンロード

[D-1-3] High-Aspect-Ratio Fine Cu Sidewall Interconnection over Chip Edge with Tapered Polymer for MEMS-LSI Multi-Chip Module

A. Noriki¹、Y. Kaiho¹、E. Iwata¹、Y. Ohara¹、M. Murugesan¹、K. W. Lee¹、J. C. Bea¹、T. Fukushima¹、T. Tanaka¹、M. Koyanagi¹ (1.Tohoku Univ.)

2009 International Conference on Solid State Devices and Materials |PDF ダウンロード

[D-1-4] Back-Side Illuminated CMOS Image Sensor Fabricated using Compliant Bump

N. Watanabe¹、I. Tsunoda²、T. Takao¹、K. Tanaka³、T. Asano¹ (1.Kyushu Univ.(Japan)、2.Kyushu Inst. Of Tech.(Japan)、3.Kyushu Sangyo Univ.(Japan))

2009 International Conference on Solid State Devices and Materials |PDF ダウンロード

[D-1-5] Tantalum lightshield for CMOS image sensor with global shutter

J. Gambino¹、R. J. Rassel¹、A. Watts¹、C. Musante¹、R. Krishnasamy¹、B. Leidy¹、N. Lai¹、T. C. Lee¹、P. Razina¹、C. Walsh¹、B. Czabaj¹、R. Preston¹、D. Demuynck¹、J. Adkisson¹、J. Ellis-Monaghan¹、M. Jaffe¹ (1.IBM)

2009 International Conference on Solid State Devices and Materials |PDF ダウンロード

[D-1-6] Nondestructive Warpage Measurements of LSI Chips in a Stacked SiP by using High-Energy X-ray Diffraction

A. Toda¹、N. Ikarashi¹ (1.NEC Corp.)

2009 International Conference on Solid State Devices and Materials |PDF ダウンロード

[D-2-1] Wireless Interconnection by Electromagnetic Coupling of Open-Ring Resonators and Its Application to System Integration

Y. Ohno¹、I. Awai² (1.Univ. of Tokushima(Japan)、2.Ryukoku Univ.(Japan))

2009 International Conference on Solid State Devices and Materials |PDF ダウンロード

[D-2-2] Transmission Characteristics of Silicon On-chip Integrated Antennas as Millimeter-Wave Wireless Interconnects

W. Moriyama¹、K. Kimoto¹、S. Kubota¹、N. Sasaki¹、T. Kikkawa¹ (1.Hiroshima Univ.)

2009 International Conference on Solid State Devices and Materials |PDF ダウンロード

[D-2-3] High Gain and High Directivity UWB Bow-tie Antenna with High Impedance Metamaterial Surface

S. Kubota¹、N. Sasaki¹、Y. Kayaba¹、W. Moriyama¹、T. Kozaki¹、T. Kikkawa¹ (1.Hiroshima Univ.)

2009 International Conference on Solid State Devices and Materials |PDF ダウンロード