[C-8-2] Stress from Tungsten-Filled TSVs Measured by Raman Spectroscopy on Cross-Sectional Samples

J. Gambino¹、D. Vanslette¹、B. Webb¹、C. Luce¹、G. Chrisman¹、T. Ueda²、T. Ishigaki²、K. Kang²、W. S. Yoo² (1.IBM、2.WaferMasters, Inc. , USA)

https://doi.org/10.7567/SSDM.2011.C-8-2