Local Interface Strength Evaluation for LSI Interconnect with Micron Resolution

N. Shishido; C. Chen; H. Sato; S. Kamiya; M. Nishida; M. Omiya; T. Nokuo; T. Nagasawa; T. Suzuki; T. Nakamura

doi:https://doi.org/10.7567/SSDM.2011.C-8-5

2011 International Conference on Solid State Devices and Materials

2011年9月27日〜 2011年9月30日
Aichi Industry & Labor Center (WINC AICHI), Nagoya, Japan

[C-8-5] Local Interface Strength Evaluation for LSI Interconnect with Micron Resolution

N. Shishido^1,5、C. Chen¹、H. Sato^1,5、S. Kamiya^1,5、M. Nishida^1,5、M. Omiya^2,5、T. Nokuo^3,5、T. Nagasawa^3,5、T. Suzuki⁴、T. Nakamura⁴ (1.Nagoya Inst. of Tech.、2.Keio Univ.、3.JEOL Ltd.、4.Fujitsu Labs Ltd.、5.CREST-JST , Japan)

https://doi.org/10.7567/SSDM.2011.C-8-5

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