[C-9-3] Oxidation Resistance of Ti Oxide Self-Formed Barrier in Cu Interconnects

K. Ito¹, K. Kohama¹, K. Hamasaka¹, Y. Shirai¹, M. Murakami² (1.Kyoto Univ., 2.The Ritsumeikan Trust , Japan)

https://doi.org/10.7567/SSDM.2011.C-9-3