16:30 〜 16:50

[K-4-3] W and Copper Interconnection Stability for 3D VLSI CoolCube Integration

C. Fenouillet Beranger¹, S. Kerdiles¹, F. Deprat^1,3, P. Batude¹, M. P. Samson^2,1, B. Previtali¹, N. Rambal^1,2, V. Lapras^1,2, L. Emery², C. Euvrard Colnat¹, A. Seignard^1,2, P. Besson^2,1, KachtouliR. ¹, A. Roman^2,1, C. Ribiere¹,^○V. Lu^2,1, L. Brunet¹, E. Gourvest², G. Druais², Y. Loquet², L. Arnaud¹, Y. Le Friec², O. Pollet¹, V. Benevent¹, F. Aussenac¹, H. Denis¹, V. Jousseaume¹, S. Maitrejean¹, M. Vinet¹ (1.CEA-LETI, 2.STMicroelectronics, 3.IMEP(France))

https://doi.org/10.7567/SSDM.2015.K-4-3